Developed and Maintained TPSs for circuit card and box level designs
Developed both Functional and Comprehensive Performance Tests
Designed ITAs
Designed ATLAS programs for MATS and TESTCOM Programs for Teradyne L321 and L323 Systems
Assisted with Design Verification for multiple board and box designs
Responsible for all environmental test (VIBE, Thermal Vac, Thermal Cycle, Mechanical Shock, EMI/EMC)
Series 7000 Commercial Communications Satellites
Custom command and telemetry bus
Developed and Maintained TPSs for circuit card and box level designs
Developed both Functional and Comprehensive Performance Tests
Designed ITAs
Designed TESTCOM Programs for Teradyne L321 and L323 Systems
Assisted with Design Verification for multiple board and box designs
Responsible for design verification for the Redundant Telemetry Module (RTM) Circuit Cards and Box designs for Echo Star and Intelsat designs
Worked directly with system design team to verify custom chip set designs, circuit card designs, and box functionality
Responsible for TPS design for the RTM
Designed, documented, integrated, and certified TPSs for 10 RTM circuit cards (design verification and manufacturing test)
Designed, documented, integrated, and certified TPSs for 3 different RTM Boxes (design verification and manufacturing test)
Responsible for all environmental test (VIBE, Thermal Vac, Thermal Cycle, Mechanical Shock, EMI/EMC)
TIROS Military Weather Satellite
Custom command and telemetry bus
Developed and Maintained TPSs for circuit card and box level designs
Developed both Functional and Comprehensive Performance Tests
Designed ITAs
Designed TESTCOM Programs for Teradyne L321 and L323 Systems
Assisted with Design Verification for multiple board and box designs
Responsible for design verification for the Redundant Telemetry Module (RTM) Circuit Cards and Box designs for Echo Star and Intelsat designs
Worked directly with system design team to verify custom chip set designs, circuit card designs, and box functionality
Responsible for TPS design for the RTM
Designed, documented, integrated, and certified TPSs for 10 RTM circuit cards (design verification and manufacturing test)
Designed,documented, integrated, and certified TPSs for 3 different RTM Boxes (design verification and manufacturing test)
Responsible for all environmental test (VIBE, Thermal Vac, Thermal Cycle, Mechanical Shock, EMI/EMC)
A2100 Commercial and Military Communications Satellites
1553 based command and telemetry bus
Developed and Maintained TPSs for circuit card and box level designs
Developed both Functional and Comprehensive Performance Tests
Designed universal printed circuit based ITAs – now used for multiple programs
Designed TESTCOM Programs for Teradyne L321 and L323 Systems
Assisted with Design Verification for multiple board and box designs
Worked directly with system design team to verify custom chip set designs, FPGA designs, circuit card designs, and functionality for 8 different box types and more than 15 circuit card designs
Participated in “Tiger Team” effort to design, document, fabricate, and test the Earth/Sun Sensor box when Lockheed Martin’s supplier failed to deliver.
The Tiger Team completed new circuit card and box from concept to delivery in less than 6 weeks
Designed,documented, integrated, and certified TPSs for more than 15 circuit cards (design verification and manufacturing test)
Designed, documented, integrated, and certified TPSs for 8 different Boxes (design verification and manufacturing test)
Responsible for all environmental test (VIBE, Thermal Vac, Thermal Cycle, Mechanical Shock, EMI/EMC)
Continued to support A2100 test team for last seven years – On going contract with Lockheed Martin to support engineering changes and test software updates (7 years)
Earth Observing System satellite Terra (formerly AM-1) EOS – Scientific Satellite
1553 based command and telemetry bus
Developed and Maintained TPSs for circuit card and box level designs
Developed both Functional and Comprehensive Performance Tests
Utilized universal printed circuit based ITAs
Designed TESTCOM Programs for Teradyne L321 and L323 Systems
Assisted with Design Verification for multiple board and box designs
Worked directly with system design team to verify custom chip set designs, FPGA designs, circuit card designs, and functionality for 20 different box types and more than 15 circuit card designs
Designed, documented, integrated, and certified TPSs for more than 15 circuit cards (design verification and manufacturing test)
Designed, documented, integrated, and certified TPSs for 20 different Boxes (design verification and manufacturing test)
Responsible for all environmental test (VIBE, Thermal Vac, Thermal Cycle, Mechanical Shock, EMI/EMC)
Prepared and presented L-series related training classes for Lockheed Martin Employees
Prepared and presented LASAR related training classes for Lockheed Martin Employees
